Study of multilayer packaging delamination mechanisms using surface analysis techniques
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Universidad de La Rioja
info
ISSN: 0169-4332
Argitalpen urtea: 2010
Alea: 256
Zenbakia: 12
Orrialdeak: 3799-3805
Mota: Artikulua
Beste argitalpen batzuk: Applied Surface Science
Laburpena
Multilayer packaging, consisting of different layers joined by using an adhesive or an extrusion process, is widely used to promote different products, such as food, cosmetics, etc. The main disadvantage in using this form of packaging is the delamination process. In this work, different surface techniques (X-ray photoelectron spectroscopy, time-of-flight secondary ion mass spectroscopy and attenuated total reflection Fourier transform infrared spectroscopy) are used to analyse the delaminated surfaces in order to study the mechanisms that cause delamination of multilayer packaging. According to our results, the reaction of migrated molecules with adhesive-aluminium bonds is the main cause of the chemical delamination process. In contrast, the delamination of extruded materials would seem to be caused by the breaking of Van der Waals bonds. © 2010 Elsevier B.V. All rights reserved.