Lead encapsulation by a golden clamp through multiple electrostatic, metallophilic, hydrogen bonding and weak interactions

  1. Echeverría, R. 1
  2. López-De-Luzuriaga, J.M. 1
  3. Monge, M. 1
  4. Moreno, S. 1
  5. Olmos, M.E. 1
  6. Rodríguez-Castillo, M. 1
  1. 1 Universidad de La Rioja
    info

    Universidad de La Rioja

    Logroño, España

    ROR https://ror.org/0553yr311

Revista:
Chemical Communications

ISSN: 1359-7345

Año de publicación: 2018

Volumen: 54

Número: 3

Páginas: 295-298

Tipo: Artículo

beta Ver similares en nube de resultados
DOI: 10.1039/C7CC08710A SCOPUS: 2-s2.0-85040191387 WoS: WOS:000419142200016 GOOGLE SCHOLAR

Otras publicaciones en: Chemical Communications

Proyectos relacionados

Aplicaciones de compuestos oro en fotofísica, medicina y catálisis

2016/00155/001

Resumen

The structure of the complex [{Pb(HBpz3)}{Au3(o-C6BrF4)3(HBpz3)}] consists of a host-guest heterometallic system built up through a plethora of interactions including electrostatic, metallophilic, H-bonding, Au⋯Br or weak C⋯C or Pb⋯Br contacts. Computational studies show that the dispersive interactions are responsible for the attraction of the Pb(ii) cationic moiety within the basket-like trinuclear Au(i) fragment, whereas the ionic component of the interaction placed at the rings produces a molecular clamp. © 2018 The Royal Society of Chemistry.